Articles by M.F. Abdullah (2)

Thermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow Process

S. Abdullah, M.F. Abdullah, A.K. Ariffin and A. Jalar

American Journal of Applied Sciences 6 ( 4 ): 616 - 625 , 2009

Computational Ballistic Performance of Metal Panel using Different Material Constitutive Models

N.A. Rahma, S. Abdulla, W.F.H. Zamr, M.F. Abdullah, M.Z. Omar and Z. Sajuri

Journal of Engineering and Applied Sciences 11 ( 3 ): 375 - 379 , 2016

Do you have a suggestion for journals

Suggest Journal