Articles by A. Jalar (4)

Thermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow Process

S. Abdullah, M.F. Abdullah, A.K. Ariffin and A. Jalar

American Journal of Applied Sciences 6 ( 4 ): 616 - 625 , 2009

The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition

M.K. Md Arshad, A. Jalar, I. Ahmad and G. Omar

American Journal of Applied Sciences 4 ( 3 ): 133 - 141 , 2007

Effect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die Packages

M.F. Rosle, I. Abdullah, S. Abdullah, M.A.A. Hamid, A.R. Daud and A. Jalar

American Journal of Engineering and Applied Sciences 2 ( 1 ): 17 - 24 , 2009

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

Z. Kornain, A. Jalar, N. Amin, R. Rasid and C. S. Foong

American Journal of Engineering and Applied Sciences 3 ( 1 ): 83 - 89 , 2010

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