Research Article 
Research of Network Properties and Power Consumption on THIN
Baojun Qiao, Shengbin Liang and Wei Wei
Information Technology Journal, 2014, 13(4), 795-800.
Abstract
A new chip design paradigm called Network-on-Chip (NoC) offers a promising architectural choice for future System-on-Chip (SoC). Communication latency and power efficiency are the most important concerns in NoC architecture design. Triple-based Hierarchical Interconnection Network (THIN) was proposed that aims to decrease the node degree, reduce the links and shorten the diameter. In this study, the zero-load latency and energy consumption are thoroughly studied and compared with 2-D mesh. The compare results show that THIN is a better candidate for constructing the NoC than 2-D mesh, when there are not too many nodes.
ASCI-ID: 28-2423
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